UL Recognized Thermal Conductive Pad 0.5mmT For Telecom Hardware 20 Shore00

1.8W / MK UL recognized thermal conductive pad 0.5mmT For Telecommunication hardware 20 Shore00

The TIF520-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


TIF500-18-11US Datasheet-REV02.pdf
Features:
> Good thermal conductive: 1.8W/mK
>Thickness:0.5mmT
>Outstanding thermal performance
>UL recognized
>Soft and compressible for low stress applications
>Naturally tacky needing no further adhesive coating
>Electrically isolating
>Broad range of hardnesses available
Applications:

>Telecommunication hardware
>Handheld portable electronics
>Memory Modules
>Mass storage devices
>CD-Rom, DVD-Rom cooling
>LED Power Supply
>LED Controller
>Heat Sinking Housing at LED-lit BLU in LCD
>LED TV and LED-lit lamps
>RDRAM memory modules

Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.  

Ziitek D-U-N-S® Number: 656191068