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| Categories | Resin Bond Diamond Blades |
|---|---|
| Brand Name: | HT |
| Model Number: | HT-RB |
| Certification: | ISO9001:2015&ISO16949 |
| Place of Origin: | Henan, China (Mainland) |
| MOQ: | 2 |
| Price: | Price can be negotiated |
| Payment Terms: | T/C,T/T |
| Supply Ability: | 300/pcs per month |
| Delivery Time: | 2-3weeks |
| Packaging Details: | Carton Box |
| Blade Material: | Diamond |
| Finishing: | Other |
| Size: | 58 |
| Application: | Semicoductor,Ceramic chips |
| Thickness: | 0.25MM |
| Bond: | Resin |
Resin bond daimond dicing Blade for wafer semicoductor,ceramic chips
Hongtuo’s HT-RB series resin bond diamond blades are some of the most advanced in diamond grinding technology. They apply a thermosetting resin bond material and inter it with diamond abrasives. This diamond grinding tool features an outstanding flexibility and can greatly improve cutting efficiency.It has become a preferred super abrasive tool for cutting hard, brittle and delicate materials, such as glass and crystalline materials.
Features:
1. Theresin bond diamond dicing blade comes with a great self-sharpening performance, which ensures a consistent sharpness and a high cutting efficiency.
2. Resin bonds are extremely flexible, therefore improving the surface finish quality.
Applications:
This dicing blade is best suited for cutting hard and brittle materials such as quartz and glass.
Specifications
Technical Parameters
| O.D | Thickness | I.D | ||||
| Size | Tolerance | Size | Standard tolerance | High precision tolerance | Size | Tolerance |
| 50~ 100 | +0.02 | 0.1~≤ 0.15 | ±0.005 | 25.4 30 31.75 40 60 80 88.9 | +0.02~ 0 | |
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