Sign In | Join Free | My chinaqualitylighting.com
chinaqualitylighting.com
Products
Search by Category
Wholesale Marketplace
Home > Other Machinery & Industry Equipment >

FR4 PCB Multilayer Boards with ENIG High Frequency High Level Bonding Material

Categories Multilayer PCB
Brand Name: XCE
Model Number: XCEM
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin: China
MOQ: 1pcs
Price: negotiation
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Delivery Time: 5-10 days
Packaging Details: inner: vacuum-packed bubble bag  outer: carton box
Min line space: 3mil
Min line width: 3mil
Copper thickness: 1OZ
Size: 8*4cm
Board THK: 1.0MM
Panel: 2*1
Surface finish: immersion gold
Model: XCEM
Brand: XCE
Material raw: Rogers
Color: Green
Layer: 1
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

FR4 PCB Multilayer Boards with ENIG High Frequency High Level Bonding Material

FR4 PCB Multilayer Boards ENIG High Frequency High Level Bonding Material


Quotation Requirement :


Following specifications are needed for quotation:

a) Base material


b) Board thickness


c) Copper thickness


d) Surface treatment


e) color of solder mask and silkscreen


f) Quantity


Parameter:


Max panel size508*610mm
Board thickness toleranceT0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness>0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress28820Sec
Testing voltage50-300V
Min buried blind via0.2mm(8mil)
Outer copper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickless0.075mm-5mm
Taphole aperture0.2mm-0.6mm
Special technologyIndepedance,Blind buried via,thick gold,aluminum PCB
Surface finishHASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

Delivery Time for PCB board:


1) PCB production time: sample: 3-4 days / mass production: within 7 days


2) Component purchase: 2 days if all components is available in our domestic market.


3) PCB Assembly: samples: whthin 2 days / mass production: within 5 days


Shipping Method and Payment terms:


1. By DHL, UPS, FedEx, TNT using clients account.


2. We suggest you using our DHL, UPS, FedEx, TNT forwarder.


3. By EMS (Usually for Russia Clients), price is high.


4. By sea for mass quantity according to customer's requirement.


5. By customer's Forwarder


6.By Paypal,T/T,West Union,etc.


Testing Procedures For PCB Board:


We perform multiple quality assuring procedures before shipping out any PCB board.

These include:


* Visual Inspection


* Flying probe


* Impedance control


* Solder-ability detection


* Digital metallograghic microscope


* AOI (Automated Optical Inspection)


Buy FR4 PCB Multilayer Boards with ENIG High Frequency High Level Bonding Material at wholesale prices
Send your message to this supplier
 
*From:
*To: Shenzhen Xinchenger Electronic Co.,Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0