LED Heat Conduction Silicone Pad High Thermal Conductivity for Optimal Thermal Interface Materials
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Thermal Interface Materials High Thermal Conductivity LED Heat Conduction Silicone Pad Thermal Conductive Pads Gap Filler Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Gray -25℃ - 125℃ Thermal Interface Material Phase Change for High Power LED Lights
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...Thermal Interface Material Phase Change for High Power LED Lights TIC™805G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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180cc High Thermally Conductive Single Part Fillers Thermal Interface Material for LED
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...Thermally Conductive Single Part Fillers Dispensable Material for LED Discription of Thermally Conductive Single Part Fillers: Thermally Conductive Single Part Fillers is a silicone resin as the base material, adding thermally conductive fillers and bonding materials configured in a certain ratio, and processed through a special process to become a paste gap filling material......
Trumony Aluminum Limited
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1.4W/M.K LED Thermal Interface Pad , Conductive Thermal Gap Filler Pad Reusable
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... interface between electronic components and heat sink or product outer covering. Specifications: 1. Thermal conductivity 1.0 W/M.K~6.0W/M.K 2. Thickness 0.2-20mm 3. Customized 4. Easy to install APPLICATION * Communication equipment * LED lighting *...
SZ PUFENG PACKING MATERIAL LIMITED
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal......
Adcol Electronics (Guangzhou) Co., Ltd.
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5274 Two-Part Thermal Gel Enhanced Heat Dissipation In New Energy Vehicles With Thermal Interface Materials
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5274 TDS-EN.pdf 5274 is a two-component silicone thermal conductive gel, which be able to cure at room temperature or accelerate curing at high temperature Product Description Silicone thermal conductive composite Blue/white gel 1:1 mixture of two ......
Shanghai Huitian New Material Co., Ltd
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TIC800P Low Melting Point Thermal Interface Materials Thermal Phase Changing Material
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...Thermal Interface Materials Thermal Phase Changing Material The TIC™800P series is low melting point thermal interface material. At 50℃, TIC™800P series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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34W Thermal Interface Materials Grey Gap Filler Thermal Pad Thermal Conductivity
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...Thermal Pad Gap Filler Laird Thermal Conductivity 34W Grey Aligned Graphite Silicone Free Product Description Tflex™ HP34 is an exceptional gap filler product with a thermal conductivity of 34 W/mK. Tflex HP34 is a non silicone formulation containing aligned graphite materials. Compared to typical graphite-based materials, Tflex HP34 is considerably softer with excellent deflection properties. Features and Benefits 34 W/mK bulk thermal...
ZSUN CHIPS CO., LTD
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Silicone Practical Heatsink Cooling Pad , Reach Thermal Interface Material Pad
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0.5mm Ultra Soft High Breakdown Voltage 1.0W/m.K Thermal Silicone Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced Fiberglass - Color White and Brick Red Visual Thickness(mm) 0.5~12.0 ASTM D374 Density(g/cc) 2.5 ASTM ......
Shenzhen Aochuan Technology Co., Ltd
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0.23mm Silicon Coated Heat Conductive Material PC Power Thermal Interface
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...Material PC Power Thermal Interface These heat conductive silicon products are applied to sink, PCBA, because of their high heat dissipating capacity and electrial isolation performance, as well as their high heat conductivity and compatible surface characteristic. Another product is Pyrolytic Graphite Sheet, it is a thermal interface material which is very thin, synthetically made, has high thermal...
Boalv New Material Technology Co., Ltd.
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