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Stack Via Sip Package Substrate

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stack via sip package substrate

from 5 Products

Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System

... with a system or sub-system in one single package. It is essential to next-generation package for fulfilling high performance and significant electrical characteristics by short interconnection paths.SiP is a substrate that enables to combine 2 or...

HongRuiXing (Hubei) Electronics Co.,Ltd.

Address: Tianyue building 711,518100 shajing centre bao'an district Shenzhen city

9 Pins 10 Pins Network Resistor , High Precision Sip Resistor Pack

... process controls are used in every step of production to insure 'built-in' reliability and consistent quality. FEATURES: Small in size with high precision package It is suitably used in...

SHENZHEN JINGDACHENG ELECTRONICS CO.,LTD

Address: 1221, SHANGYOU GONG GUAN, GONGYE Rd, LONGHUA DISTRICT, SHENZHEN CITY, CHINA

Air Differential Pressure Transmitter Stack Flow Water Pressure Sensor

...Stack Flow Water Pressure Sensor Description 4-20ma air differential pressure transmitter stack flow This series of micro differential pressure transmitter adopts piezoresistive pressure sensor chip, and uses the film resistance on the substrate to carry out zero point correction, zero point temperature compensation and sensitivity compensation. The high-performance and stable silicon chip package......

Xi'an Yunyi Instrument Co., Ltd

Address: Rm. 1203-1, Bldg. B, Xian Xinsilu International E-Commerce Industrial Park, No. 9, Gangwu Road, Int'l Port District

CC2652PSIPMOTR 2.4GHz Wireless System-in-Package With Integrated Power Amplifier

...Package With Integrated Power Amplifier Product Description Of CC2652PSIPMOTR CC2652PSIPMOTR a System-in-Package (SiP) certified module, multiprotocol 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee®, BT® 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects(6LoWPAN), proprietary systems, including the 15.4-Stack......

ShenZhen Mingjiada Electronics Co.,Ltd.

Address: 1239 New Asia Guoli Building Zhenzhong Road.,Futian district Shenzhen China

High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

... IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch......

Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

Address: Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China

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