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Thermal Gap Pad For Memory Modules

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thermal gap pad for memory modules

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Manufacture Ultra Soft Thermal Conductive Pad 0.5mmT Gray Thermal Gap Pad For Memory Modules

... thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and...

Dongguan Ziitek Electronical Material and Technology Ltd.

Address: No.12 Xiju Road,, Hengli Township, Dongguan City, 523460 Guangdong Province, China

Specific Gravity 3.0 G/Cc Heat Sink Thermal Gap Pad In Memory Modules

Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules The TIF1200-30-06UF is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives ......

Dongguan Ziitek Electronic Materials & Technology Ltd.

Address: No.12 Xiju Road,, Hengli Township, 523460 Dongguan City

TIF100-19U Customized Thermal Conductive Silicone Insulation Pad for Memory Modules

... allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductivity 1...

CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM

Address: Plot CN4, Ming Lang Industrial Cluster, Vu Thu district, Thai Binh Province, Vietnam

7.3mm 2W/MK Thermal Conductive Pad For LED Lighting , Non Silicone Gap Filler Pads

...thermal interface conductive gap pad thermal gap filler LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or product outer covering. APPLICATION * Communication equipment * LED lighting * Switch power supply * Backlight module......

SZ PUFENG PACKING MATERIAL LIMITED

Address: B/B,Shayi Dongjiang Huanbao Industrial City,Shajing Street,Shenzhen City,China

Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g/s) 5.0 ISO9048 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥5.0 ASTM D149 Dielectric Constant(@10mhz......

Shenzhen Aochuan Technology Co., Ltd

Address: 302 GuihuaRoad, GuixiangVillage, GuanlanTown, LonghuaDistrict, Shenzhen City,Guangdong Province, P.R China

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