50mm ball grid array socket

Brand Name:Original Factory

Model Number:AQC113-B1-C

Place of Origin:CN

..., Single-port Size: 12 Mm X 14 Mm Pitch: 0.8 Mm Pitch Package: 224-pin, Flip-chip Ball Grid Array (FCBGA)

Brand Name:Micron Technology Inc.

Model Number:MT47H64M16HR-25E:H

Place of Origin:original

...t is ideal for a variety of applications. It features a 16M x 16-bit configuration and is available in a 204-pin ball grid array package. It is capable of supporting up to 400 MHz clock speeds and offers high-speed data transfer rates of up to 800 Mbps.

Brand Name:Micron Technology Inc.

Model Number:MT40A256M16LY-062E:F

Place of Origin:Multi-origin

MT40A256M16LY-062E:F Flash Memory Chips Product Specifications: • Capacity: 256Mb (16M x 16) • Package: Ball Grid Array (BGA) • Temperature Range: Standard (0°C to +70°C) • Interface: DDR2 • Memory Organization: x16 • Number of Bank Bits...

Brand Name:Intel

Model Number:EP1C6Q240I7N

Place of Origin:Multi-origin

EP1C6Q240I7N Programmable IC Chip Product Parameters: • Operating Voltage: 3.3V • Maximum Clock Frequency: 66 MHz • Programmable I/O Pins: 240 • Package: Ball Grid Array • Number of Configurable Logic Cells: 8,192 • Maximum Operating Temperature: 85°C • ...

Brand Name:Intel

Model Number:EP1C4F400C8N

Place of Origin:Multi-origin

... IC Chip Parameters: - Number of Logic Cells: 4,400 - Speed: 133 MHz - Package: 144-Pin Fine Pitch Ball Grid Array - Voltage Supply Range: 1.14V - 1.26V - Maximum Power Consumption: 4.8W - Number of I/O Pins: 144 - Operating Temperature: -40°C to +...

Brand Name:Intel

Model Number:EP1C12F324I7N

Place of Origin:Multi-origin

Product Listing: EP1C12F324I7N Programmable IC Chip Description: EP1C12F324I7N is a programmable integrated circuit (IC) chip manufactured by Altera. It features 324-pin, plastic ball grid array (BGA) package, and is suitable for applications such as ...

Brand Name:AMD

Model Number:XC2C512-10FGG324I

Place of Origin:original

... for Complex Logic Applications XC2C512-10FGG324I Programmable IC Chip • Package: 324-Pin FG Fine-Pitch Ball Grid Array • Speed Grade: 10 • Number of Logic Cells: 512 • Number of Macrocells: 8 • Clock Management Tiles: 2 • DSP Slices: 32 • I/...

Brand Name:XILINX / AMD

Model Number:XC6SLX25-2FTG256I

Place of Origin:Multi-origin

... Block RAM: 12.5 Mbits • Power Management Modes: Multiple • Package: Flip-Chip Ball Grid Array (FCBGA) • Speed Grade: -2 • User Flash Memory: 8 Mbits • Maximum Frequency: 435 MHz • Number of Clock Managers: 8 • Number of ...

Brand Name:CISCO

Model Number:E-W403AAE

Place of Origin:Original

... component, possibly a FCTEBGA (Flip Chip Thin Exposed Die Ball Grid Array) package [2]. The specific details about its functionality or application are not mentioned in the search results. Manufacturer: The search results do not provide information abo...

Brand Name:Suntek

Model Number:F016-006

Place of Origin:China or Cambodia

...Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly 6) Box Build and Final assembly 7) Lead-...

Brand Name:Suntek

Model Number:F016-006

Place of Origin:China or Cambodia

...: 1) PCB, Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly 6) Box Build and Final assembly 7) Lead-...

Brand Name:Suntek/BL Suntek

Model Number:F016-007

Place of Origin:China or Cambodia

...: 1) PCB, Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly 6) Box Build and

Brand Name:Suntek

Model Number:SBBF0326-2

Place of Origin:China/Cambodia

..., 13485 :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips assembly. 7. Test in-house(ICT/FT High-pot/E-test etc) 8. A team

Brand Name:Suntek

Model Number:SBBF0326-78

Place of Origin:China/Cambodia

..., 13485 :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips assembly.

Brand Name:Suntek

Model Number:FCA8569-CA4

Place of Origin:China/Cambodia

... (THT) ※ Ball Grid Array (BGA) assembly and inspection ※ Wire harness & cable assembly ※ Box Build and Final assembly ※ Lead-Free,RoHS,Reach ...

Brand Name:Suntek

Model Number:SBBF0324

Place of Origin:China/Cambodia

..., 13485 :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips assembly. 7. Test in-house(ICT/FT High-pot/E-test etc) 8. A team of English speaking engineers .

Brand Name:Suntek

Model Number:SBBF0326-45

Place of Origin:China/Cambodia

..., 13485 :2016, IATF 16949 : 2016, UL 476377 certified. 5. Lead free, ROHs and Reach compliant ,Halogen-free. 6. Ball Grid Array(BGA)/0201 chips assembly. 7. Test in-house(ICT/FT High-pot/E-test etc) 8. A team of English speaking engineers .

Brand Name:Horexs

Place of Origin:china

... represented by the ball grid array packaging chip size packaging came out,IC carrier as a new packaging carrier came into being IC board is developed on the basis of ...