bga ball grid array

Brand Name:Shinelink

Model Number:SL0925S01

Place of Origin:China

...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the

Brand Name:HSTECH

Model Number:HS-800

Place of Origin:China

...BGA Rework Station for Electronic Assembly​ Introduction: A BGA Rework Station is specialized equipment used for the repair and rework of Ball Grid Array (BGA) components on printed circuit boards (PCBs). These stations are essential in electronics manufacturing and repair, allowing technicians to replace or repair BGAs...

Brand Name:OEM/ODM

Model Number:SL00710S04

Place of Origin:China

...BGA PCB SMT Assembly Electronics PCBA EMS Service 8 Layers PCB BGA PCB is Printed Circuit Boards with Ball Grid Array. We use various sophisticated techniques for making BGA PCBs. Such PCBs have a small size, low cost, and high packaging density. Hence, they are reliable for high-performance applications. Benefits of BGA PCB 1. Efficient Use of Space BGA...

Brand Name:WZ

Model Number:WZ-580C WZ-620C WZ-650C WZ-750C

Place of Origin:China

...Ball Grid Array (BGA) components. It enables the removal and replacement of BGA components on printed circuit boards (PCBs), allowing for repairs and modifications to be made. The BGA rework station consists of several key components, including a heater, a

Brand Name:WZ

Model Number:WZ-580C

Place of Origin:China

...Ball Grid Array (BGA) components. It enables the removal and replacement of BGA components on printed circuit boards (PCBs), allowing for repairs and modifications to be made. The BGA rework station consists of several key components, including a heater, a

Brand Name:WZ

Model Number:WZ-580C WZ-620C WZ-650C WZ-750C

Place of Origin:China

... of ball grid array (BGA) components on printed circuit boards (PCBs). It offers a range of functionality and features that enable the safe removal and replacement of BGAs, ensuring reliable and efficient rework processes. Functionality: BGA Removal: The

Brand Name:PG

Place of Origin:China

Hard Disk mSATA 128GB 256GB for Laptop SATA 3.0 SSD 512GB 1TB 2TB for POS Machine Features Form Factor: Smaller size compared to traditional SSD. Ideal for compact devices. Interface: Uses the SATA interface, which provides compatibility with a wide range...

Brand Name:HSTECH

Model Number:HS-620

Place of Origin:China

... Position BGA Rework Station Introduction: A BGA Rework Station is a specialized equipment used in the electronics manufacturing and repair industry to rework or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). BGA components are ...

Brand Name:HSTECH

Model Number:HS-520

Place of Origin:China

...BGA Touch Screen Rework Station with & CE Introduction: A BGA Rework Station is a specialized tool used in electronics manufacturing and repair to manage the rework and repair of Ball Grid Array (BGA) components on printed circuit boards (PCBs). These stations are essential for tasks such as replacing faulty BGA...

Brand Name:Loranger

Model Number:Ball Grid Array (BGA)/Chip Scale Package (CSP) Sockets

...ball to Board Pad Optional Heat Sink Item # Item Name Package Name Number of Input/Output (I/O) Pitch 006004006J6617 6 Input/Output (I/O) and 0.23/0.22 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket BGA/CSP 6 Multi0.22 mm0.23 mm...

Brand Name:HSTECH

Model Number:HS-520

Place of Origin:China

...Touch Screen 3 Heating Zones Manual BGA Rework Station with & CE Introduction: A BGA Rework Station is a specialized tool used in the electronics manufacturing industry to repair or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs...

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

...repairing and reworking Ball Grid Array (BGA) components on mobile phone circuit boards. These stations are crucial in the electronics repair industry, especially for repairing smartphones and other portable devices. ...

Brand Name:HNL-PCBA

Model Number:PCB Assembly 06

Place of Origin:CHINA

...BGA PCB'A FR4 PCB Circuit Board Double Side PCB Assembly Double Side PCB Assembly Introduction The double-sided printed circuit board (also double-layer board)provides on both side conductive paths for assembly of components, then to fabricate the PCB'A. Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs...

Brand Name:HNL-PCBA

Model Number:PCB Assembly 06

Place of Origin:CHINA

...BGA PCB'A FR4 PCB Circuit Board Double Side PCB Assembly Double Side PCB Assembly Introduction The double-sided printed circuit board (also double-layer board)provides on both side conductive paths for assembly of components, then to fabricate the PCB'A. Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs...

Brand Name:YDY

Model Number:Y-004

Place of Origin:China

Printed Circuit Boards Automated PCB Assembly Ball Grid Array Assembly Shenzhen YDY Technology Co., Ltd is to be the most professional PCBA/PCB manufacturer for prototyping and low-volume production to work with in the world. With more than a decade in ...

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

... BGA components on printed circuit boards (PCBs). BGA components are surface-mount integrated circuits (ICs) that have a grid of solder balls on the underside, which pose unique challenges during repair and rework. Key Components: Precision Heating System

Brand Name:HSTECH

Model Number:HS-520

Place of Origin:China

...BGA Rework Station 3 Heating Zones Manual For Electronic Assembly Products Description BGA Rework Station: Purpose: BGA rework stations are specialized equipment used to remove and replace BGA components on printed circuit boards (PCBs). BGA components are surface-mount integrated circuits (ICs) that have a grid of solder balls...

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

... of solder ball as the I/O end of the circuit and the printed circuit board (PCB) interconnection.BGA is a class of chip packaging technology, rework BGA chip machine and equipment is called the BGA rework station its rework range includes a variety of

Brand Name:WDS

Model Number:WDS1800

Place of Origin:CHINA

...BGA balls. This feature eliminates the need for manual alignment, reducing the risk of errors and increasing efficiency. The HD monitor provides a clear view of the BGA balls, making it easy to monitor the rework process. With a maximum PCB size of 640*490mm, this BGA...

Brand Name:Original Factory

Model Number:XCZU28DR-L1FFVG1517I

Place of Origin:CN

...Gate Array BGA Package​ Product Description Of XCZU28DR-L1FFVG1517I XCZU28DR-L1FFVG1517I is Field Programmable Gate Array - Integrated Circuit Chip, the package is BGA. Specification Of XCZU28DR-L1FFVG1517I Part Number: XCZU28DR-L1FFVG1517I Package: BGA ...