bga ball grid array

Brand Name:HNL-PCBA

Model Number:Double Side PCB Assembly

Place of Origin:CHINA

... coating and complete assembly for clients all. Producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs

Brand Name:SenYan

Model Number:2 layers pcb

Place of Origin:China

...PCBA – SMT & Through Hole parts) 4. Surface-mount technology (SMT) Ball-grid array (BGA) Through-hole 5. Plastic Enclosure (Mould) Manufacturing 6. Metal Enclosure (Tool) Manufacturing 7. Cable & Wire harness Assembly 8. Final Assembly 9. ...

Brand Name:HNL-PCBA

Model Number:PCB Assembly 06

Place of Origin:CHINA

... the PCB'A. Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for

Brand Name:HNL-PCBA

Model Number:Double Side PCB Assembly

Place of Origin:CHINA

... coating and complete assembly for clients all. Producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs

Brand Name:CKS

Model Number:CKS-Customized

Place of Origin:CHINA

...), to support customer’s product idea. Programming of Micro Controllers, Memory Devices, and Programmable Logic Surface Mounting Technology (SMT) & Ball Grid Array (BGA) with repair capability In-circuit Test, Functional

Brand Name:Original Factory

Model Number:5M2210ZF324C5N

Place of Origin:CN

... Complex Programmable Logic Devices​ Product Description Of 5M2210ZF324C5N 5M2210ZF324C5N 324-Pin FineLine Ball-Grid Array (FBGA) , In System Programmable Chip, the Operating Temperature is 0°C ~ 85°C (TJ). Specification Of 5M2210ZF324C5N Par...

Brand Name:LINK-PP

Model Number:H5200NL / H5200NLT

Place of Origin:Guangdong,China

... Transformer 1CT:1CT Surface Mount Detailed Information: APPLICATION-LAN ETHERNET TRANSFORMER/CHOKE NUMBER OF PORTS DUAL PACKAGE BGA BUMP GRID ARRAY PACKAGE HEIGHT MM 11.180 PACKAGE LENGTH MM 14.730 PACKAGE WIDTH MM 17.270 ...

Brand Name:LINK-PP

Model Number:H5201NL / H5201NLT

Place of Origin:Guangdong,China

... MODULE XFORMR DUAL GIGABIT SMD Detailed Information: APPLICATION-LAN ETHERNET TRANSFORMER/CHOKE NUMBER OF PORTS DUAL PACKAGE BGA BUMP GRID ARRAY PACKAGE HEIGHT MM 11.180 PACKAGE LENGTH MM 14.730 PACKAGE WIDTH MM 17.270 ...

Brand Name:LINK-PP

Model Number:H5400NL / H5400NLT

Place of Origin:Guangdong,China

... MODULE XFORMR QUAD GIGABIT SMD Detailed Information: APPLICATION-LAN ETHERNET TRANSFORMER/CHOKE NUMBER OF PORTS QUAD PACKAGE BGA BUMP GRID ARRAY PACKAGE HEIGHT MM 11.180 PACKAGE LENGTH MM 28.450 PACKAGE WIDTH MM 17.270 ...

Brand Name:LINK-PP

Model Number:H5401NL

Place of Origin:Guangdong,China

H5401NL MODULE XFORMR QUAD GIGABIT SMD APPLICATION-LAN ETHERNET TRANSFORMER/CHOKE NUMBER OF PORTS QUAD PACKAGE BGA BUMP GRID ARRAY PACKAGE HEIGHT MM 11.180 PACKAGE LENGTH MM 28.450 PACKAGE WIDTH MM 17.270 POE RATING 4PAIR POE 30W SPEED 1000BASE-T ...

Brand Name:LINK-PP

Model Number:H5610NL / H5610NLT

Place of Origin:Guangdong,China

... 10/100/1000 Base-T Pulse Transformer APPLICATION-LAN ETHERNET TRANSFORMER/CHOKE NUMBER OF PORTS SINGLE PACKAGE BGA BUMP GRID ARRAY PACKAGE HEIGHT MM 11.180 PACKAGE LENGTH MM 7.870 PACKAGE WIDTH MM 17.270 POE ...

Brand Name:LINK-PP

Model Number:H6400NL

Place of Origin:Guangdong,China

... applications requiring superior signal integrity and reliable power delivery. These LAN Transformers feature an open frame construction in a BGA (Bump Grid Array) package, optimized for 1000BASE-T data transmission. Engineered to comply with IEEE 802

Brand Name:Intel

Model Number:EP3C16F484C8N

Place of Origin:Multi-origin

...800 • Logic Array Blocks (LABs):280 • I/O Pins: 144 • Memory Bits: 18,432 • User Flash Memory: 10,000 • Embedded Multipliers: 16 • Maximum User I/Os: 144 • Core Voltage: 1.2V • Package Type: Fine-pitch Ball Grid Array (FBGA) • Operating

Brand Name:Original Factory

Model Number:MCIMX7S5EVM08SD

Place of Origin:CN

... ball grid array; 541 balls; 0.75 mm pitch; 19 mm x 19 mm x 1.33 mm body. Specification Of MCIMX7S5EVM08SD Part Number: MCIMX7S5EVM08SD Number Of ...

Brand Name:Yizhuo

Model Number:Aluminum Pcb Board 01

Place of Origin:China

..., sinking gold, minimum hole 0.2MM Dielectric: FR-4 Flame retardant performance: V0 Package form: fine pitch ball grid array packaging technology Product Name:

Brand Name:Yizhuo

Model Number:mc pcb01

Place of Origin:China

...Pitch 0.2mm Minimum chip size 0201(0.2x0.1)/0603(0.6x0.3mm) Maximum BGA size 74x74mm BGA ball pitch 1.00mm(minimum), 3.00mm(maximum) BGA ball diameter 0.40mm(minimum), 1.00mm(maximum) QFP lead pitch 0.38mm(minimum), 2.54mm(maximum) Volume One piece to low ...

Brand Name:ST

Model Number:STM8S207S6T6C

Place of Origin:Switzerland

ST Hot sale electronic components STM8S207S6 bridge rectifier microcontroller ic chip ball grid array integrated circuit STM8S207S6T6C The STM8S207S6T6C is a microcontroller unit based on a high-performance ARM®Cortex®-M432 bit RISC kernel, ...

Brand Name:Hansion

Model Number:FR4 double side PCBA

... Max PCB Size 1200mm*400mm Min PCB Thinkness 0.35mm Min Chip Size 01 005 Max BGA Size 74mm*74mm BGA Ball Pitch 1.0-3.00 BGA Ball Diameter 0.2 - 1.0mm QFP Lead Pitch

Brand Name:Original Factory

Model Number:MIMX8DX1AVOFZAC

Place of Origin:CN

... i.MX 8DualXPlus FBGA417 Applications Processors​ Product Description Of MIMX8DX1AVOFZAC MIMX8DX1AVOFZAC fine-pitch ball grid array package, 417 terminals, 0.8 mm pitch, i.MX 8DualXPlus Applications Processors​. Specification Of MIMX8DX1AVOFZAC...