ddr socket emmc pcb

Brand Name:Jetacon

Model Number:USB3.0 connector

Place of Origin:Guang Dong

Note: some times the item is from customized products, the actual product will have some minor difference from the photo, thanks.

Brand Name:Jetacon

Model Number:USB3.0 connector

Place of Origin:Guang Dong

Note: some times the item is from customized products, the actual product will have some minor difference from the photo, thanks.

Brand Name:TOPCBS

Model Number:DDR Socket PCB

Place of Origin:Suzhou China

...PCBs for LPDDR3 Socket Interposer stack up 4-2-4 immersion gold The demand for higher data rates and larger data densities lead to the evolution of SDR into the DDR concept. The demand for higher data rates and larger data densities lead to the evolution of SDR into the DDR. In the DDR SDRAM, the data is clocked at both edges – positive as well as negative edge – which results in doubling the data rate. In this way, DDR...

Brand Name:TOPCBS

Model Number:DDR Socket PCB

Place of Origin:Suzhou China

...PCBs for LPDDR3 Socket Interposer stack up 4-2-4 immersion gold The demand for higher data rates and larger data densities lead to the evolution of SDR into the DDR concept. The demand for higher data rates and larger data densities lead to the evolution of SDR into the DDR. In the DDR SDRAM, the data is clocked at both edges – positive as well as negative edge – which results in doubling the data rate. In this way, DDR...

Model Number:PJ-PCIXXXXXX

DDR AND PCI SOCKET TERMINAL: COPPER, BASE: PLASTIC, PBT, 94V-0, COLOR: RED, ORANGE, WITHE, BLACK. ALL MATERIAL ARE COMPALINT WITH ROHS. APPLICATION: PCB PCI CARD.

Brand Name:Horexs

Place of Origin:CHINA

eMMC IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC substrate,IC assembly,Storage IC substrage; Spec.of pcb...

Brand Name:TE Connectivity AMP Connectors

Model Number:1-1473005-1

Place of Origin:China

...DDR SDRAM Socket Details : 200 Position SODIMM DDR SDRAM Socket Surface Mount, 25° Angle Description: CONN SKT SODIMM 200POS SMD IC Category Connectors, Interconnects 　Series Memory Connectors - Inline Module Sockets MFG 　 TE Connectivity AMP Connectors 　Part number 1-1473005-1 Package 　 Tray Part Status Active Connector Style SODIMM Number of Positions 200 Memory Type DDR

Place of Origin:China

Brand Name:Customized

RK 3399 Pro VGA Development Electronic PCB Control DDR, DDR4, DDR3 Testing Before delivery, we will apply a variety of test methods to PCBA in or already mounted: IQC: Material inspection. IPQC: Production ...

Brand Name:SunChip

Model Number:AD-B03

Place of Origin:Shenzhen, China

Hardware customization Rockchip RK3399 system on module support 4K resolution 4GB DDR 16GB eMMC Model No: AD-B03-V1.5 Overview AD-B03 is using a Rockchip Hexa-core processor, based on Big. Little ...

Brand Name:PLCC 84 adaptor

Model Number:PLCC 84 adaptor

PLCC 84 adaptor we also have many other items IC in stock , pls kindly check it: SDRAM- PC100 SD 8Mx16-10 FBGA lead free EDS1216GABH-10-E Elpida 20000 booking SD 2Mx8-8 PC125 CL3 TSOP HY57V168010DTC-8 Hynix 3000 3 days SD 8Mx32-PC100 EDS2532AABH-1AR2-E ...

Brand Name:Horexs

Place of Origin:CHINA

...,consumer electronics. Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, the IC substrate can protect the circuit, special line, it is

Brand Name:sealan

Model Number:S05-2

Place of Origin:China

..., up to1.3Ghz Ram: DDR 512GB SSD Storage: EMMC 8GB Touch screen: Capacitive 5 Point touch G+P Warranty(Year): 1-Year Certification: FCC, ce, RoHS Screen Size: 7" ...

Brand Name:PG

Model Number:G25128TLCA

Place of Origin:China

...eMMC for Tablet PC AR VR Smartphone 128GB eMMC Key features and applications of eMMC 1. Integration: eMMC integrates storage chips, controllers, and interfaces into a single package, simplifying the design and connection process. 2. Packaging form: Usually provided in BGA (Ball Grid Array) packaging form, with a set of spherical solder balls at the bottom for connecting the package to the printed circuit board (PCB...