interfacing material

Brand Name:Ziitek

Model Number:TIC™810P

Place of Origin:China

Phase change material CPU cooling TIC™810P series is low melting point thermal interface material.At 50℃, TIC™800P series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit ...

Brand Name:Ziitek

Model Number:TIC™800A-AL series

Place of Origin:China

Calculator Server Heat Dissipation Phase Change Material PCM TIC™812G series is low melting point thermal interface material. At 50℃, TIC™800A-AL series begins to soften and flow, filling the microscopic irregularities of both the thermal solution...

Brand Name:Ziitek

Model Number:TIC™805A-AL series

Place of Origin:China

Phase Change Material PCM TIC™805A-AL series is low melting point thermal interface material. At 50℃, TIC™805A-AL series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit ...

Brand Name:Ziitek

Model Number:TIC800K-A1

Place of Origin:China

RoHS Recognized Low Melting 1.5W Phase Changing Materials For Laptop Computer TIC®800K-A1 Series this series is a high-performance and high-cost-utilization thermal interface material. lts unique grain directionality and plate structure allow it to be ...

Brand Name:Ziitek

Model Number:TIC800G

Place of Origin:China

...Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&...

Brand Name:ZIITEK

Model Number:TIF150-30-12U

Place of Origin:China

... and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full ...

Brand Name:Ziitek

Model Number:TIC800Y

Place of Origin:China

... pad pcm TIC 800Y With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, ...

Brand Name:B&R

Model Number:X20IF1041-1

Place of Origin:Austria

...Interface MATERIAL NUMBER: X20IF1041-1 DESCRIPTION: CANopen master Integrated terminating resistor The interface module is equipped with a CANopen interface. This allows third-party components to be integrated in the B&R system and makes it possible to quickly and easily transfer data in both directions. The interface...

Brand Name:B&R

Model Number:X20IF1061-1

Place of Origin:Austria

...Interface MATERIAL NUMBER: X20IF1061-1 DESCRIPTION: PROFIBUS DP V1 master The interface module is equipped with a PROFIBUS DP V1 interface. This allows third-party components to be integrated in the B&R system and makes it possible to quickly and easily transfer data in both directions. The interface...

Brand Name:BOALV

Model Number:0.3-10

Place of Origin:China; USA

...material , silicon products for PC power sink. These heat conductive silicon products are applied to sink, PCBA, because of their high heat dissipating capacity and electrial isolation performance, as well as their high heat conductivity and compatible surface characteristic. Another product is Pyrolytic Graphite Sheet, it is a thermal interface material...

Brand Name:BOALV

Model Number:0.3-10

Place of Origin:China; USA

...Material PH5 1.6W/mk TIS800K These heat conductive silicon products are applied to sink, PCBA, because of their high heat dissipating capacity and electrial isolation performance, as well as their high heat conductivity and compatible surface characteristic. Another product is Pyrolytic Graphite Sheet, it is a thermal interface material...

Brand Name:BOALV

Model Number:0.075

Place of Origin:China; USA

... performance, as well as their high heat conductivity and compatible surface characteristic. Another product is Pyrolytic Graphite Sheet, it is a thermal interface material which is very thin, synthetically made, has high thermal conductivity, and is made

Brand Name:BOALV

Model Number:0.3-10

Place of Origin:China; USA

...materials These heat conductive silicon products are applied to sink, PCBA, because of their high heat dissipating capacity and electrial isolation performance, as well as their high heat conductivity and compatible surface characteristic. Another product is Pyrolytic Graphite Sheet, it is a thermal interface material...

Brand Name:BOALV

Model Number:0.3-10

Place of Origin:China; USA

... capacity and electrial isolation performance, as well as their high heat conductivity and compatible surface characteristic. Another product is Pyrolytic Graphite Sheet, it is a thermal interface material which is very thin, synthetically made, has

Brand Name:Ziitek

Model Number:TIF600 Series

Place of Origin:China

...Thermal Pad Thermal Interface Pads For Set Top Boxes Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our ...

Brand Name:Ziitek

Model Number:TIF1100-32-05US thermal pad

Place of Origin:China

...interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing

Brand Name:Ziitek

Model Number:TCP100-01PP

Place of Origin:China

...point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products,

Brand Name:ZIITEK

Model Number:TIF1120-15-02S

Place of Origin:China

...Materials 1.5W Silicone thermal gap pad for Chip heat dissipation Company profile Dongguan Zhaoke Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials...