precision ball grid array assembly

Brand Name:Intel

Model Number:EP3C16F484C8N

Place of Origin:Multi-origin

...800 • Logic Array Blocks (LABs):280 • I/O Pins: 144 • Memory Bits: 18,432 • User Flash Memory: 10,000 • Embedded Multipliers: 16 • Maximum User I/Os: 144 • Core Voltage: 1.2V • Package Type: Fine-pitch Ball Grid Array (FBGA) • Operating

Brand Name:Original Factory

Model Number:MCIMX7S5EVM08SD

Place of Origin:CN

... ball grid array; 541 balls; 0.75 mm pitch; 19 mm x 19 mm x 1.33 mm body. Specification Of MCIMX7S5EVM08SD Part Number: MCIMX7S5EVM08SD Number Of ...

Brand Name:PG

Model Number:G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB

Place of Origin:Shenzhen, China

.../write speeds of up to 400MB/s, making it ideal for applications requiring fast data access and reliable storage. Featuring a compact BGA (Ball Grid Array

Brand Name:PG

Model Number:G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB

Place of Origin:Shenzhen, China

... MultiMedia Card) is an embedded non-volatile storage solution. It integrates NAND flash chips and flash controllers into a small BGA (Ball Grid Array) package, providing devices with a highly integrated, low-cost, and

Brand Name:ZANE

Model Number:UFSTYPE

Place of Origin:China

...Precision Ball Screw Ball screw assembly consists of screw, nut, end support unit and coupling, the function is to convert rotary motion into linear motion, or convert linear motion into rotary motion. Because of the high stiffness and accuracy, ball screw is widely used for all kinds of industrial equipments and precise instruments. Product ground ball...

Brand Name:HSTECH

Model Number:HS-620

Place of Origin:China

... used in the electronics manufacturing and repair industry to rework or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). BGA components are commonly used due to their high density and performance, but they can be challenging...

Brand Name:HSTECH

Model Number:HS-520

Place of Origin:China

... is a specialized tool used in the electronics manufacturing industry to repair or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). These components are popular due to their high density and performance but can be challenging to work wit...

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

...repairing and reworking Ball Grid Array (BGA) components on mobile phone circuit boards. These stations are crucial in the electronics repair industry, especially for repairing smartphones and other portable ...

Brand Name:Original Factory

Model Number:MIMX8DX1AVOFZAC

Place of Origin:CN

... i.MX 8DualXPlus FBGA417 Applications Processors​ Product Description Of MIMX8DX1AVOFZAC MIMX8DX1AVOFZAC fine-pitch ball grid array package, 417 terminals, 0.8 mm pitch, i.MX 8DualXPlus Applications Processors​. Specification Of MIMX8DX1AVOFZAC...

Brand Name:Original Factory

Model Number:MIMX8ML6CVNKZAB

Place of Origin:CN

...MIMX8ML6CVNKZAB MIMX8ML6CVNKZAB is i.MX 8M Plus Quad Microprocessor Chip, low profile, fine-pitch, ball grid array package, 548 terminals, 0.5 mm pitch. Specification Of MIMX8ML6CVNKZAB Part Number: MIMX8ML6CVNKZAB Core Type: 4 X Arm Cortex-A53 Operating ...

Brand Name:Original Factory

Model Number:MIMX8MN5DVPIZAA

Place of Origin:CN

...MIMX8MN5DVPIZAA MIMX8MN5DVPIZAA is i.MX 8M Nano UltraLite Quad Microprocessors IC, thin ball grid array package, 306 terminals, the package is 306-TFBGA (11x11). Specification Of MIMX8MN5DVPIZAA Part Number MIMX8MN5DVPIZAA USB Controllers 1 Serial...

Brand Name:Original Factory

Model Number:MIMX8MN5CVPIZAA

Place of Origin:CN

... MCU 1.4GHz MIMX8MN5CVPIZAA TBGA306 4 Core Microprocessors IC​ Product Description Of MIMX8MN5CVPIZAA MIMX8MN5CVPIZAA TBGA306, thin ball grid array package, 306 terminals, i.MX 8M Nano UltraLite Quad Applications Processors. 1x Gigabit Ethernet...

Brand Name:Original Factory

Model Number:MIMX8MN1DVTJZAA

Place of Origin:CN

... Real-time integrity checker (RTIC), i.MX 8M Nano SoloLite. The package is LFBGA486, low profile fine-pitch ball grid array. Specification Of MIMX8MN1DVTJZAA Part Number MIMX8MN1DVTJZAA Video/Display features MIPI-CSI,MIPI-DSI Audio Specific Modules 8-ch ...

Brand Name:Original Factory

Model Number:MCIMX7S3DVK08SD

Place of Origin:CN

...®-A7 and Cortex-M4 Cores. Package is TFBGA488, plastic, thin fine-pitch ball grid array. Specification Of MCIMX7S3DVK08SD Part Number MCIMX7S3DVK08SD USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 3.3V Operating Temperature 0°C ~ ...

Brand Name:Original Factory

Model Number:MCIMX7U3CVP06SD

Place of Origin:CN

...-power. The package is LFBGA393, low profile fine-pitch ball grid array. Specification Of MCIMX7U3CVP06SD Part Number: MCIMX7U3CVP06SD Number Of Cores/Bus Width: 1 Core, 32-Bit Operating Frequency(Max): 650MHz ...

Brand Name:Original Factory

Model Number:LS1027AXE7PQA

Place of Origin:CN

... enabled. Package is FBGA448, fine-pitch ball grid array package. Product Attributes Of LS1027AXE7PQA Part Number: LS1027AXE7PQA Qualification Tier: Industrial Core Type Arm: Cortex-A72 Number Of ...

Brand Name:Original Factory

Model Number:LS1017ASN7PQA

Place of Origin:CN

...Description Of LS1017ASN7PQA LS1017ASN7PQA is Single Core 1.5GHz​ Processors Chip, FBGA448, fine-pitch ball grid array package. Two high-speed USB 2.0/3.0 controllers with integrated PHY. Product Attributes Of LS1017ASN7PQA Part Number: LS1017ASN7PQA Timers: 8 ...

Brand Name:Original Factory

Model Number:AQC113-B1-C

Place of Origin:CN

..., Single-port Size: 12 Mm X 14 Mm Pitch: 0.8 Mm Pitch Package: 224-pin, Flip-chip Ball Grid Array (FCBGA)

Brand Name:Micron Technology Inc.

Model Number:MT47H64M16HR-25E:H

Place of Origin:original

...t is ideal for a variety of applications. It features a 16M x 16-bit configuration and is available in a 204-pin ball grid array package. It is capable of supporting up to 400 MHz clock speeds and offers high-speed data transfer rates of up to 800 Mbps.