wafer level package

Brand Name:GST

Model Number:GST412W

Place of Origin:Wuhan, Hubei Province, China

... adopts the Wafer Level Packaging (WLP) technology that has low cost and high yield on the market. Thanks to the wafer level packaging, the GST412W thermal infrared detector could produce clear infrared thermal image up to 120,000 pixels without

Brand Name:BeyondView

Model Number:FW312

Place of Origin:Beijing

... microbolometer structure has optimal sensitivity to long wavelengths between 8 and 14µm. FW312 infrared detector uses wafer-level packaging technology to minimize size and weight while ensuring stability and reliability, achieving a more compact and

Brand Name:Mingseal

Model Number:GS600SW

Place of Origin:China

...Packaging Wafer-Level Underfill & Flux Jetting Machine The GS600SW Wafer-Level Underfill Dispenser is Mingseal’s flagship dispensing module designed for next-generation wafer-level packaging (WLP) and advanced redistribution layer (RDL) processes. Built to handle high-complexity underfill and flux spray operations, it is ideal for Fan-Out Wafer-Level Packaging...

Brand Name:Hiner-pack

Model Number:8 Inch 2mm Inner Height

Place of Origin:Made In China

...Wafer Jar Packaging With Accessories The Silicon Wafer Jar packaging primarily used to store and transport silicon wafers for the semiconductor industry. We have a wide range of sizes for customers to choose from. In addition to the wafer jar and lid, it also comes with electrically conductive Foam cushion in pink, Foam liner and white tyvek paper. This is a specialized and efficient silicon wafer

Brand Name:zmkj

Model Number:dia3x0.12mmt

Place of Origin:China

...wafer single tray is a container used to hold and protect a single 4-inch sapphire wafer during transport and storage. Here are some common specifications for a 4-inch sapphire wafer single tray: - Wafer size: 4 inches (100 mm) - Material: Polycarbonate or

Brand Name:Truth Instruments

Model Number:Wafer-MOKE

... of hysteresis loop information including free layer and pinned layer Hc, Hex, and M (Kerr angle value), as well as rapid mapping of wafer magnetic characteristic distribution. With

Brand Name:NSWprint

Model Number:J36

Place of Origin:Guangzhou, China

...Wafer Biscuit Packaging Folding Mailer Box details: Product Name Food Grade Folding Mailer Carton Boxes Wafer Biscuit Packaging Size (L*W*H) Customized Shape Square / Rectangle/ Hexagon Color Customized Price Negotiable Material 350gsm coated paper Print 4c print Finishing Matte varnishing Brand OEM and ODM are available, and we can print your logo on the box Packaging...

Brand Name:Sme Electromechanical PLC Drive Cleaning Machine Purification System 8200 Specifications Sufficient Supply Delivery

Model Number:SME-8200

Place of Origin:china

Product Description: The Semiconductor Cleaning Machine is an automatic cleaning device that is designed to effectively remove water-based flux and other types of contamination from various electronic components. Measuring 8250*1970*1770mm (L*W*H), this ...

Brand Name:ADI

Model Number:ADUC7023BCBZ62I-R7

Place of Origin:CN

ADUC7023BCBZ62I-R7 ARM Microcontrollers - MCU ADuC7023 in Wafer-Level CSP FEATURES Analog I/O Multichannel, 12-bit, 1 MSPS ADC Up to 12 ADC channels Fully differential and single-ended ...

Brand Name:skyiwnbake

Model Number:two

Place of Origin:gungdong , China

Product Description High Speed Wafer Biscuit Automatic Packing Line wafer automatic feeding and packing line including separation conveyor ,distribution conveyor , pushing device, storage conveyor and automatic packing machine.Products are aligned fir...

Brand Name:Waylead

Model Number:WL-420

Place of Origin:Shanghai

Product Description: Features: High Efficiency: Our bakery packing machine is able to pack 30-450 packs per minute, allowing for quick and efficient packaging of your products. Automatic Packaging: The machine operates automatically, reducing the need for ...

Brand Name:onsemi

Model Number:FDN340P

Place of Origin:original

FDN340P MOSFET Power Electronics Single P-Channel POWERTRENCH Logic Level Package SOT-23 Drain to Source Voltage (Vdss) 20 V Current - Continuous Drain (Id) @ 25°C 2A (Ta) Drive ...

Brand Name:Taichuan

Model Number:TCZB-250,TCZB-320,TCZB-450

Place of Origin:Foshan , Guangdong, China

Scourer packaging machine , Aborbent Cloth wrapping machine,Sponge packaging machine , foam packing machine Application: Horizontal pillow flow pack is suitable for :Food (Snack bar,bread,cookies,ice lolly,cake.chocolate,) Plastic(Cutlery,tray,) hardware(...

Brand Name:Bachmann

Model Number:BS208

Place of Origin:Germany

Product:Bachmann BS208 all in stock 100% new original Bachmann BS208 N.S.E.Automation is a leading global industrial supplier in China.We specialize in control systems and drives with many years.We promise All of our products are 100% New Factory Original ...

Brand Name:BonTek

Model Number:Fused Silica, Fused Quartz

Place of Origin:China

...Wafer 4'' 6'' 8'' for MEMS Devices Glass wafers made of borosilicate glass are often used in Semiconductor and MEMS industry in a wide variety of applications. These wafers can be used for the encapsulation of MEMS devices for example for sensors using Wafer-Level-Packaging (WLP) technology or as blank glass substrates for semiconductor processing and optics. The borosilicate glass wafers...

Brand Name:ZMSH

Model Number:Silicon Carbide Wafer

Place of Origin:China

... and thermal properties. It is a high-performance semiconductor that is ideal for a wide variety of applications. In addition to its high thermal resistance, it also features a very high level of hardness. Compared to other semiconductors, a

Brand Name:MICRO ACCURACY

Model Number:SPC500

Place of Origin:china

... CSPS and so on. Features & Advantages of Wafer Inspecting microscope ■ High-precision marble base, table and column to ensure high stability and rigidity ■ Marble table design, with ...

Brand Name:FUNSONIC

Model Number:FS620

Place of Origin:CHINA

...Wafer Coating Description: Wafer coating is a unique process that facilitates the automatic application of chip bonding adhesives at the wafer level, followed by the formation of chip bonding films in the next stage. FUNSONIC's ultrasonic semiconductor wafer coating technology is suitable for wafer coating, which can achieve process speed, thickness control, and material uniformity. After the hot or UVB stage and wafer

Brand Name:STARLAND

Model Number:XT-28

Place of Origin:Guangdong guangzhou

Large Scale Wafer Cone Making Machine with CE Features of Wafer Cone Making Machine Are you ready to take your wafer cone production to the next level? Look no further than our incredible Large Scale Wafer Cone Making Machine! With its high precision molds...

Brand Name:KACISE

Model Number:KVS140

Place of Origin:CHINA

... of tuning fork vibration. It is the base of the induction rod of the tuning fork level switch. The tuning fork is driven by the piezoelectric wafer, and the vibration signal is received by another piezoelectric wafer, so that the vibration signal can be