what is ddr memory

Categories:Memory IC Chip

Country/Region:china

SRAM - Synchronous, DDR II+ Memory IC 36Mbit Parallel 550 MHz 165-FBGA (13x15)

Categories:Memory IC Chip

Country/Region:china

SRAM - Synchronous, DDR II Memory IC 18Mbit HSTL 250 MHz 450 ps 165-FBGA (13x15)

Brand Name:OEM/ODM

Place of Origin:China

Model Number:TPS61030PWPR

...analog multiplexer, and DDR memory. The memory range of the chip is from 256 bytes to 64KB, and the available packages include QFP and BGA. It has a pin count of 8 to 100 pins and is available in three ...

Brand Name:OEM/ODM

Place of Origin:China

Model Number:PE9354-11

..., adjustable current output (max) and storage temperature from -55C to +150C. It is capable of operating at voltage levels of 3.3V, 5V and 12V, and memory capacity ranging from 256B to 64KB. These features make it an ideal choice for

Brand Name:Original Factory

Model Number:STM32MP157FAB1

Place of Origin:CN

... external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz. Specification Of STM32MP157FAB1 Part Number: STM32MP157FAB1 External DDR Memory: Up To 1 Gbyte Internal SRAM: 708 Kbytes Of Internal SRAM LSI

Brand Name:Original Factory

Model Number:STM32MP135FAG7

Place of Origin:CN

...APB buses, AHB buses, and a 64-bit multi-layer AXI interconnect supporting internal and external memories access. Specification Of STM32MP135FAG7 Part Number: STM32MP135FAG7 External DDR Memory: Up To 1 Gbyte AHB SRAM: 32 Kbytes SRAM: 8 Kbytes Of SRAM In

Brand Name:XILINX / AMD

Model Number:XC7A200T-2SBG484I

Place of Origin:Multi-origin

... package - 24 transceivers with up to 12.5Gbps - 4 PLLs and 4 GTP transceivers - 32-bit and 64-bit double-data-rate (DDR) memory interface support - PCIE Gen3 x4, Gen2 x4, Gen1 x4,

Brand Name:Winbond Electronics

Model Number:W949D6DBHX5I

Product Details GENERAL DESCRIPTION W9425G6DH is a CMOS Double Data Rate synchronous dynamic random access memory (DDR SDRAM), organized as 4,194,304 words × 4 banks × 16 bits. Using pipelined architecture and 0.11 µm process technology, W9425G6DH delivers...

Brand Name:Micron Technology Inc.

Model Number:MT49H16M18SJ-25:B TR

...DESCRIPTION The Micron® 256Mb Reduced Latency DRAM (RLDRAM) contains 8 banks x32Mb of memory accessible with 32-bit or 16-bit I/Os in a double data rate (DDR) format where the data is provided and synchronized with a differential echo clock signal. RLDRAM...

Brand Name:Winbond Electronics

Model Number:W949D2DBJX5I

Product Details GENERAL DESCRIPTION W9425G6DH is a CMOS Double Data Rate synchronous dynamic random access memory (DDR SDRAM), organized as 4,194,304 words × 4 banks × 16 bits. Using pipelined architecture and 0.11 µm process technology, W9425G6DH delivers...

Brand Name:Winbond Electronics

Model Number:W9464G6KH-5

Product Details GENERAL DESCRIPTION W9425G6DH is a CMOS Double Data Rate synchronous dynamic random access memory (DDR SDRAM), organized as 4,194,304 words × 4 banks × 16 bits. Using pipelined architecture and 0.11 µm process technology, W9425G6DH delivers...

Brand Name:OEM

Model Number:B450-AMD-V1.0 motherboard

Place of Origin:CHINA

... (supports the 1st, 2nd, 3rd, 4th and 5th generation CPU of Ryzen) Chipset AMD B450 technology:Dual-channel memory architecture DDR4 (supporting DDR 4 3200/2933/2666/2400/2133 MHz) Memory slot/maximum capacity:Equipped with two 288-Pin DDR4 memory

Brand Name:OEM

Model Number:B450-AMD-V1.0 motherboard

Place of Origin:CHINA

...3rd, 4th and 5th generation CPU of Ryzen) Chipset AMD B450 technology:Dual-channel memory architecture DDR4 (supporting DDR 4 3200/2933/2666/2400/2133 MHz) Memory slot/maximum capacity:Equipped with two 288-Pin DDR4 memory slots, the maximum support is 64G

Brand Name:OEM

Model Number:B450-AMD-V1.0 motherboard

Place of Origin:CHINA

... CPU of Ryzen) Chipset AMD B450 technology:Dual-channel memory architecture DDR4 (supporting DDR 4 3200/2933/2666/2400/2133 MHz) Memory slot/maximum capacity:Equipped with two 288-Pin DDR4 memory slots, the maximum support is 64G(32G*2). Jaudio:1

Brand Name:OEM

Model Number:B450-AMD-V1.0 motherboard

Place of Origin:CHINA

... the 1st, 2nd, 3rd, 4th and 5th generation CPU of Ryzen) Chipset AMD B450 technology:Dual-channel memory architecture DDR4 (supporting DDR 4 3200/2933/2666/2400/2133 MHz) Memory slot/maximum capacity:Equipped with two 288-Pin DDR4 memory slots, the maximum

Brand Name:OEM

Model Number:B450-AMD-V1.0 motherboard

Place of Origin:CHINA

... the 1st, 2nd, 3rd, 4th and 5th generation CPU of Ryzen) Chipset AMD B450 technology:Dual-channel memory architecture DDR4 (supporting DDR 4 3200/2933/2666/2400/2133 MHz) Memory slot/maximum capacity:Equipped with two 288-Pin DDR4 memory slots, the maximum

Brand Name:OEM

Model Number:B450-AMD-V1.0 motherboard

Place of Origin:CHINA

... generation CPU of Ryzen) Chipset AMD B450 technology:Dual-channel memory architecture DDR4 (supporting DDR 4 3200/2933/2666/2400/2133 MHz) Memory slot/maximum capacity:Equipped with two 288-Pin DDR4 memory slots, the maximum support is 64G(32G*2

Brand Name:Horexs

Place of Origin:china

...memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory...

Brand Name:Horexs

Model Number:NC-02

Place of Origin:china

...memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory...

Brand Name:Horexs

Place of Origin:china

...memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory...