azimuth socket ball grid array

Brand Name:Original Factory

Model Number:5M2210ZF324C5N

Place of Origin:CN

... Complex Programmable Logic Devices​ Product Description Of 5M2210ZF324C5N 5M2210ZF324C5N 324-Pin FineLine Ball-Grid Array (FBGA) , In System Programmable Chip, the Operating Temperature is 0°C ~ 85°C (TJ). Specification Of 5M2210ZF324C5N Par...

Place of Origin:Shenzhen,China

Brand Name:ONESEINE

Model Number:ONE-102

... line space 3mil Min hole 0.2mm Solder mask and silkscreen yes BGA PCB knowledge: BGA,means Ball Grid Array, Spherical pin grid array packaging technology, high-density surface mount

Brand Name:Intel

Model Number:EP3C16F484C8N

Place of Origin:Multi-origin

...800 • Logic Array Blocks (LABs):280 • I/O Pins: 144 • Memory Bits: 18,432 • User Flash Memory: 10,000 • Embedded Multipliers: 16 • Maximum User I/Os: 144 • Core Voltage: 1.2V • Package Type: Fine-pitch Ball Grid Array (FBGA) • Operating

Brand Name:PG

Model Number:G25128TLCA

Place of Origin:China

... the design and connection process. 2. Packaging form: Usually provided in BGA (Ball Grid Array) packaging form, with a set of spherical solder balls at the bottom for connecting the package to the printed circuit board (PCB). 3. Application areas

Brand Name:Original Factory

Model Number:MCIMX7S5EVM08SD

Place of Origin:CN

... ball grid array; 541 balls; 0.75 mm pitch; 19 mm x 19 mm x 1.33 mm body. Specification Of MCIMX7S5EVM08SD Part Number: MCIMX7S5EVM08SD Number Of ...

Brand Name:WZ

Model Number:WZ-580C WZ-620C WZ-650C WZ-750C

Place of Origin:China

...Ball Grid Array (BGA) components. It enables the removal and replacement of BGA components on printed circuit boards (PCBs), allowing for repairs and modifications to be made. The BGA ...

Brand Name:WZ

Model Number:WZ-580C

Place of Origin:China

...Ball Grid Array (BGA) components. It enables the removal and replacement of BGA components on printed circuit boards (PCBs), allowing for repairs and modifications to be made. The BGA ...

Brand Name:WZ

Model Number:WZ-580C WZ-620C WZ-650C WZ-750C

Place of Origin:China

... of ball grid array (BGA) components on printed circuit boards (PCBs). It offers a range of functionality and features that enable the safe removal and replacement of BGAs, ...

Brand Name:Shinelink

Model Number:SL0925S01

Place of Origin:China

... devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the

Brand Name:Yizhuo

Model Number:Aluminum Pcb Board 01

Place of Origin:China

..., sinking gold, minimum hole 0.2MM Dielectric: FR-4 Flame retardant performance: V0 Package form: fine pitch ball grid array packaging technology Product Name:

Brand Name:PG

Model Number:G25128TLIA

Place of Origin:China

.../write speeds of up to 400MB/s, making it ideal for applications requiring fast data access and reliable storage. Featuring a compact BGA (Ball Grid Array

Brand Name:ST

Model Number:STM8S207S6T6C

Place of Origin:Switzerland

ST Hot sale electronic components STM8S207S6 bridge rectifier microcontroller ic chip ball grid array integrated circuit STM8S207S6T6C The STM8S207S6T6C is a microcontroller unit based on a high-performance ARM®Cortex®-M432 bit RISC kernel, ...

Brand Name:HSTECH

Model Number:HS-620

Place of Origin:China

... used in the electronics manufacturing and repair industry to rework or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). BGA components are commonly used due to their high density and performance, but they can be challenging...

Brand Name:HSTECH

Model Number:HS-520

Place of Origin:China

... is a specialized tool used in the electronics manufacturing industry to repair or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). These components are popular due to their high density and performance but can be challenging to work wit...

Brand Name:HSTECH

Model Number:HS-520

Place of Origin:China

... is a specialized tool used in electronics manufacturing and repair to manage the rework and repair of Ball Grid Array (BGA) components on printed circuit boards (PCBs). These stations are essential for tasks such as replacing faulty BGA chips, soldering new...

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

...a specialized piece of equipment designed for repairing and reworking Ball Grid Array (BGA) components on mobile phone circuit boards. These stations are crucial in the electronics repair industry, especially for repairing smartphones and other portable ...

Brand Name:HSTECH

Model Number:HS-800

Place of Origin:China

... Assembly​ Introduction: A BGA Rework Station is specialized equipment used for the repair and rework of Ball Grid Array (BGA) components on printed circuit boards (PCBs). These stations are essential in electronics manufacturing and repair, allowing ...