azimuth socket ball grid array

Brand Name:Original Factory

Model Number:MIMX8DX1AVOFZAC

Place of Origin:CN

... i.MX 8DualXPlus FBGA417 Applications Processors​ Product Description Of MIMX8DX1AVOFZAC MIMX8DX1AVOFZAC fine-pitch ball grid array package, 417 terminals, 0.8 mm pitch, i.MX 8DualXPlus Applications Processors​. Specification Of MIMX8DX1AVOFZAC...

Brand Name:Original Factory

Model Number:MIMX8ML6CVNKZAB

Place of Origin:CN

...MIMX8ML6CVNKZAB MIMX8ML6CVNKZAB is i.MX 8M Plus Quad Microprocessor Chip, low profile, fine-pitch, ball grid array package, 548 terminals, 0.5 mm pitch. Specification Of MIMX8ML6CVNKZAB Part Number: MIMX8ML6CVNKZAB Core Type: 4 X Arm Cortex-A53 Operating ...

Brand Name:Original Factory

Model Number:MIMX8MN5DVPIZAA

Place of Origin:CN

...MIMX8MN5DVPIZAA MIMX8MN5DVPIZAA is i.MX 8M Nano UltraLite Quad Microprocessors IC, thin ball grid array package, 306 terminals, the package is 306-TFBGA (11x11). Specification Of MIMX8MN5DVPIZAA Part Number MIMX8MN5DVPIZAA USB Controllers 1 Serial...

Brand Name:Original Factory

Model Number:MIMX8MN5CVPIZAA

Place of Origin:CN

... MCU 1.4GHz MIMX8MN5CVPIZAA TBGA306 4 Core Microprocessors IC​ Product Description Of MIMX8MN5CVPIZAA MIMX8MN5CVPIZAA TBGA306, thin ball grid array package, 306 terminals, i.MX 8M Nano UltraLite Quad Applications Processors. 1x Gigabit Ethernet...

Brand Name:Original Factory

Model Number:MIMX8MN1DVTJZAA

Place of Origin:CN

... Real-time integrity checker (RTIC), i.MX 8M Nano SoloLite. The package is LFBGA486, low profile fine-pitch ball grid array. Specification Of MIMX8MN1DVTJZAA Part Number MIMX8MN1DVTJZAA Video/Display features MIPI-CSI,MIPI-DSI Audio Specific Modules 8-ch ...

Brand Name:Original Factory

Model Number:MCIMX7S3DVK08SD

Place of Origin:CN

...®-A7 and Cortex-M4 Cores. Package is TFBGA488, plastic, thin fine-pitch ball grid array. Specification Of MCIMX7S3DVK08SD Part Number MCIMX7S3DVK08SD USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Voltage - I/O 1.8V, 3.3V Operating Temperature 0°C ~ ...

Brand Name:Original Factory

Model Number:MCIMX7U3CVP06SD

Place of Origin:CN

...-power. The package is LFBGA393, low profile fine-pitch ball grid array. Specification Of MCIMX7U3CVP06SD Part Number: MCIMX7U3CVP06SD Number Of Cores/Bus Width: 1 Core, 32-Bit Operating Frequency(Max): 650MHz ...

Brand Name:Original Factory

Model Number:LS1027AXE7PQA

Place of Origin:CN

... enabled. Package is FBGA448, fine-pitch ball grid array package. Product Attributes Of LS1027AXE7PQA Part Number: LS1027AXE7PQA Qualification Tier: Industrial Core Type Arm: Cortex-A72 Number Of ...

Brand Name:Original Factory

Model Number:LS1017ASN7PQA

Place of Origin:CN

...Description Of LS1017ASN7PQA LS1017ASN7PQA is Single Core 1.5GHz​ Processors Chip, FBGA448, fine-pitch ball grid array package. Two high-speed USB 2.0/3.0 controllers with integrated PHY. Product Attributes Of LS1017ASN7PQA Part Number: LS1017ASN7PQA Timers: 8 ...

Brand Name:Original Factory

Model Number:AQC113-B1-C

Place of Origin:CN

..., Single-port Size: 12 Mm X 14 Mm Pitch: 0.8 Mm Pitch Package: 224-pin, Flip-chip Ball Grid Array (FCBGA)

Brand Name:Micron Technology Inc.

Model Number:MT47H64M16HR-25E:H

Place of Origin:original

...t is ideal for a variety of applications. It features a 16M x 16-bit configuration and is available in a 204-pin ball grid array package. It is capable of supporting up to 400 MHz clock speeds and offers high-speed data transfer rates of up to 800 Mbps.

Brand Name:Micron Technology Inc.

Model Number:MT40A256M16LY-062E:F

Place of Origin:Multi-origin

MT40A256M16LY-062E:F Flash Memory Chips Product Specifications: • Capacity: 256Mb (16M x 16) • Package: Ball Grid Array (BGA) • Temperature Range: Standard (0°C to +70°C) • Interface: DDR2 • Memory Organization: x16 • Number of Bank Bits...

Brand Name:Intel

Model Number:EP1C6Q240I7N

Place of Origin:Multi-origin

EP1C6Q240I7N Programmable IC Chip Product Parameters: • Operating Voltage: 3.3V • Maximum Clock Frequency: 66 MHz • Programmable I/O Pins: 240 • Package: Ball Grid Array • Number of Configurable Logic Cells: 8,192 • Maximum Operating Temperature: 85°C • ...

Brand Name:Intel

Model Number:EP1C4F400C8N

Place of Origin:Multi-origin

... IC Chip Parameters: - Number of Logic Cells: 4,400 - Speed: 133 MHz - Package: 144-Pin Fine Pitch Ball Grid Array - Voltage Supply Range: 1.14V - 1.26V - Maximum Power Consumption: 4.8W - Number of I/O Pins: 144 - Operating Temperature: -40°C to +...

Brand Name:Intel

Model Number:EP1C12F324I7N

Place of Origin:Multi-origin

Product Listing: EP1C12F324I7N Programmable IC Chip Description: EP1C12F324I7N is a programmable integrated circuit (IC) chip manufactured by Altera. It features 324-pin, plastic ball grid array (BGA) package, and is suitable for applications such as ...

Brand Name:AMD

Model Number:XC2C512-10FGG324I

Place of Origin:original

... for Complex Logic Applications XC2C512-10FGG324I Programmable IC Chip • Package: 324-Pin FG Fine-Pitch Ball Grid Array • Speed Grade: 10 • Number of Logic Cells: 512 • Number of Macrocells: 8 • Clock Management Tiles: 2 • DSP Slices: 32 • I/...

Brand Name:XILINX / AMD

Model Number:XC6SLX25-2FTG256I

Place of Origin:Multi-origin

... Block RAM: 12.5 Mbits • Power Management Modes: Multiple • Package: Flip-Chip Ball Grid Array (FCBGA) • Speed Grade: -2 • User Flash Memory: 8 Mbits • Maximum Frequency: 435 MHz • Number of Clock Managers: 8 • Number of ...

Brand Name:CISCO

Model Number:E-W403AAE

Place of Origin:Original

... component, possibly a FCTEBGA (Flip Chip Thin Exposed Die Ball Grid Array) package [2]. The specific details about its functionality or application are not mentioned in the search results. Manufacturer: The search results do not provide information abo...

Brand Name:Suntek

Model Number:F016-006

Place of Origin:China or Cambodia

...Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly 6) Box Build and Final assembly 7) Lead-...

Brand Name:Suntek

Model Number:F016-006

Place of Origin:China or Cambodia

...: 1) PCB, Flex, Rigid-flex, MPCB,HDI bare board 2) Surface Mount Assembly (SMT) 3) Through Hole Technology (THT) 4) Ball Grid Array (BGA)/QFN/DFN assembly and Xray inspection 5) Wire harness & cable assembly 6) Box Build and Final assembly 7) Lead-...